Leica EM TXP precision research integrated machine

Leica EM TXP

New precision research all-in-one machine

A brand new precision research all-in-one machine

LEICA EM TXP

It is a unique surface treatment tool that can accurately locate the target area, especially suitable forSEM，TEMandLMCut, polish, and perform a series of treatments on the sample before observation. It is particularly suitable for preparing high difficulty samples, such as those that require precise target localization or targeted processing of small targets that are difficult to observe with the naked eye. Got itLeica EM TXPThese tasks can be easily completed.

InLeica EM TXPPreviously, performing fixed-point cutting, grinding, or polishing on the target area was usually a time-consuming, labor-intensive, and difficult task because the target area was easily lost or difficult to handle due to its small size. UseLeica EM TXPSuch samples can be easily processed.

Furthermore, leveraging its multifunctional features,Leica EM TXPIt is also an extremely efficient pre sample preparation tool that can serve ion beam grinding technology and ultra-thin slicing technology.

Integrate with the observation system

Observe the entire sample processing process and target area under a microscope
Fix the sample on the sample cantilever, and during the sample processing, the sample can be observed in real time through a stereo microscope at different angles0 ° to6 0Adjustable or adjustable-30°, distance measurement can be performed through the eyepiece ruler.Leica EM TXPIt also has a bright circular shapeLEDLight source illumination for optimal visual observation.

>Accurate positioning and sample preparation of small target areas>In situ observation through stereomicroscope
>Multi functional mechanical processing
>Automated sample processing process control

>Can achieve a mirror like polishing effect
>LEDThe brightness of the circular light source can be adjusted,4Segments are optional

< < <See the details clearly

Born for microscale sampling

Localization, cutting, grinding, and polishing of small targets at the millimeter and micrometer scales is a challenging task, mainly due to the following difficulties:

>The target is too small to be easily observed
>It is difficult to accurately locate targets or calibrate their angles
>Grinding and polishing to the designated target position often require a lot of manpower and time>Small targets are easily lost
>The sample size is small and difficult to operate, often requiring embedding and embedding

Integrated Microscopic Observation and Imaging System

Leica M80Stereomicroscope
>Parallel light path design: A parallel light path is formed through the central main objective mirror, with a consistent focal plane
>High resolution: Excellent image quality and stable light intensity at all zoom ratios>Ergonomic design: optimal comfort for use, without muscle tension or fatigue

Leica IC80 HDhigh-definition camera*
>Seamless design: Installed between the optical head and binocular tube, no need to add a picture tube or photoelectric tube>High quality images: coaxial optical path with microscope ensures image quality and obtains non reflective images>Provide dynamic high-definition images that can be used with or without a computer connection

4 Adjustable brightness of segmented sectionsLEDCircular light source>Illumination from different angles reveals tiny details of the sample

Multiple methods for preparing and processing samples

Samples do not need to be transferred, just switch tools

There is no need to transfer the sample back and forth, simply changing the tool used to process the sample can complete the sample processing process, and the entire sample processing process can be observed in real time through a microscope. For safety reasons, the workshop where the tools and samples are located is equipped with a transparent safety cover, which can prevent the operator from accidentally touching the moving parts during sample processing and also prevent debris from splashing.

LEICA EM TXPThe sample can be processed as follows:>milling
>cutting
>grinding

>Polishing>Chong Diamond

Various types of knives, saws, and polishing tools:

Automated sample processing process control

Let LeicaEM TXPCome to work
EM TXPThe automated sample processing process control mechanism can help you free yourself from the routine heavy sample preparation work:

>Equipped with automationE-WMotion control mechanism
>Equipped with an automated stress feedback mechanism
>Equipped with automated process or time countdown function
>Hollow drill with stress feedback control for automatic advancement
>Equipped with automatic lubrication coolant injection and liquid level monitoring mechanism

Accurate target positioning

>Under the assistance of a microscope, precise target positioning can be achieved through the use of precision moving tools

>Move the saw blade to a position close to the target for cutting; Then, without removing the sample, replace the saw blade with a grinding blade to quickly grind the target position; When approaching the target position, you can useCount downCountdown function, automatically grind specified thickness（∑ um）, or ultimately adoptedCount downCountdown function, automatic polishing

>Thanks to precision mechanical control components, the sample processing tool has a minimum step accuracy of up to0.5um

Accurate angle calibration

>Under the assistance of microscope observation, the angle calibration adapter helps you achieve fine adjustment of the sample angle

>The angle calibration adapter is fixed between the sample fixture and the sample cantilever, which can achieve ± 1 in both horizontal and vertical directions5Angle adjustment

LEICAEMTXP&EMTIC3X

LEICA EM TIC 3X

It is a unique three ion beam cutting instrument that can perform ion beam bombardment on soft hard composite or stress sensitive material samples to obtain sample cross-sections, which is convenient forSEMObserve the internal structural information of the sample and analyze it.

EM TXPPreparation before making samples for it:
>Sample cutting and rough grinding
>Sample repair block
>toTIC 3XGrinding and polishing the baffle to make it reusable

LEICA EM TXP & EM RES102

LEICA EM RES102

It is a fully automatic and multifunctional ion beam grinding system that can perform ion thinning (used for...)T E MInorganic material sampling); Ion beam polishing, ion etching, sample ion cleaning, and slope cutting (used forSEMInorganic material sampling, etc.

EM TXPPreparation before making samples for it:
>Mechanically thinning the sample for subsequent useRES102Ion beam thinning
>Mechanically grind and polish the sample for subsequent useRES102ion beam polishing

LEICA EM TXP & EM UC7

LEICA EM UC7

It is a Leica ultra-thin slicer that uses a diamond knife to slice samples into ultra-thin sections, which can obtainnmGrade thickness ultra-thin slice (used forTEMObservation), or15umHalf thin slices with the following thickness (forL MObservation), or cutting to obtain sample cross-sections (forL MorSEMObserve).

All samples need to be trimmed before ultra-thin sectioning. The size and shape of the sample cross-section have a significant impact on subsequent slicing. Samples with lower hardness can be used with LeicaEM TRIM2Repair machine, orEM RAPIDAdvanced block repair machine, or useEM TXPPrecision research integrated machine for repairing blocks. And hard or brittle materials must be usedEM T X PUsing cutting/Grinding/Polishing steps for sample block processing. The perfect sample block after trimming should have a flat surface and sharp edges, which is crucial for obtaining high-quality ultra-thin slices of hard or brittle samples.