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NanoT thin film thermal conductivity meter using thermal reflection method

NegotiableUpdate on 02/12

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Overview

Pulse laser thermal reflection method for thin film thermal conductivity analyzer NanoTR/PicoTR thermal reflection method - tailored laser flash method for nanoscale thin film applications Thermal reflection method for thermal conductivity analyzer based on ultra high speed laser flash system

Product Details

Pulse laser thermal reflection method thin film thermal conductivity meter

NanoTR / PicoTR

Thermal Reflection Method - Laser Flash Thermal Conductivity Meter Tailored for Nanoscale Thin Film Applications

The Thermo Reflection method is based on an ultra high speed laser flash system and can measure the thermal properties of metal, ceramic, and polymer thin films on a substrate, such as Thermal Diffusivity, Thermal Conductivity, Thermal Effusivity, and interfacial thermal resistance.

Due to the fact that the laser flash time is only in the nanosecond (ns) range, and can even reach the picosecond (ps) range, this system can measure thin films with thicknesses as low as 10nm. At the same time, the system provides different measurement modes to adapt to different substrate conditions (transparent/opaque).

This method complies with international standards:
JIS R 1689: Measurement of thermal diffusivity of fine ceramic films by pulsed laser thermal reflection method;
JIS R 1690: Measurement Method for Interface Thermal Resistance between Ceramic Thin Films and Metal Thin Films.

Brief History of Development

In 1990, the Japan Institute of Industrial Technology/National Institute of Metrology (AIST/NMIJ) invented the heat reflection method to measure the thermal conductivity of thin films.
In 2008, AIST established PicoTherm company.
In 2010, PicoTherm launched the NanoTR nanosecond thermal reflection system.
In 2012, PicoTherm launched PicoTR, a picosecond level thermal reflection system.
In 2014, PicoTherm and NETZSCH established a strategic partnership. NETZSCH is responsible for the global sales and service of PicoTherm products.

Measurement Mode

RF measurement mode		FF measurement mode

The main laser source heats the film from the back, and the temperature rise process of the film is measured from the front by the detection laser to calculate the thermal conductivity parameters of the film. This mode is applicable to transparent substrates.		The main laser source heats the film from the front, detects the temperature drop process of the film measured by the laser from the front, and calculates the thermal conductivity parameters of the film. This mode is suitable for opaque substrates.

Technical background:

Laser flash method-
The most mainstream method for testing the thermal diffusion coefficient of materials

In modern industry, knowledge about the thermal properties, especially the thermophysical properties, of materials has become increasingly important. Here we can give some typical fields, such as heat dissipation materials applied to high-performance micro electronic devices, thermoelectric materials as continuous energy sources, insulation materials in energy-saving fields, thermal barrier coatings (TBC) used in turbine blades, and safe operation of nuclear plants, and so on.

Among various thermal properties parameters, thermal conductivity is particularly important. The laser flash method (LFA) can be used to measure the thermal diffusivity/thermal conductivity of materials. This method has been widely known after many years of development and can provide reliable and accurate data results. The typical thickness of the sample is between 50um and 10mm.

NETZSCH is a world leading instrument manufacturer, providing a range of thermal property testing instruments, particularly laser flash thermal conductivity meters. These LFA systems have been widely applied in fields such as ceramics, metals, polymers, and nuclear research.

Heat reflection method-
Test the thermal diffusion coefficient of thin film materials with a thickness of nanometer level

With significant advances in electronic device design and the accompanying demand for effective thermal management, precise measurements of thermal diffusivity/conductivity within the nanoscale thickness range have become increasingly important.

The National Institute of Advanced Industrial Science and Technology (AIST) in Japan responded to industrial demand in the early 1990s and began developing the "pulse light heating heat reflection method". In 2008, PicoTherm was established and launched the nanosecond level thermal reflection instrument "NanoTR" and the picosecond level thermal reflection instrument "PicoTR". These two instruments can measure the thermal diffusion coefficient of thin films using absolute methods, and the thickness of thin films ranges from tens of micrometers to nanometers.

In 2014, NETZSCH Japan became the exclusive agent of PicoTherm. Combined with our existing LFA instruments, NETZSCH can now provide a complete set of testing solutions ranging from nanoscale thin films to millimeter scale bulk materials.

Why do we need to test thin films?
The thermal properties of thin films are different from those of bulk materials

The thickness of nanoscale thin films is usually smaller than the typical grain size of similar bulk materials. Therefore, its thermal and physical properties will have significant differences from bulk materials.

The thermal diffusion time range applicable to different instruments

Technical Specifications:

		NanoTR	PicoTR
host	temperature range 真空度 Measurement Mode	RT, RT... 300 ° C (optional) N/A RF/FF	RT, RT... 500 ° C (optional) 10^-6 Mbar (optional) RF/FF
measurement items		Thermal diffusivity coefficient, heat absorption coefficient, interface thermal resistance
Heating laser	pulse width wavelength spot diameter	1 ns 1550 nm 100 μm	0.5 ps 1550 nm 45 μm
Detecting laser	pulse width wavelength spot diameter	continuous 785 nm 50 μm	0.5 ps 775 nm 25 μm
Sample thin layer thickness (RF mode)	resin ceramics metal	30 nm . .. 2 μm 300 nm . .. 5 μm 1 μm . .. 20 μm	10 nm . .. 100 nm 10 nm . .. 300 nm 100 nm . .. 900 nm
Sample thin layer thickness (FF mode)		> 1 μm	> 100 nm
matrix	material size thickness	Opaque/Transparent 10... 20mm square ≤ 1 mm
Thermal diffusion time		10ns . .. 10µs	10ps . .. 10ns
thermal diffusivity	scope accuracy repetitiveness	0.01 . .. 1000 mm²/s CRM 5808A, 400nm thickness, RF mode, 40min test time verification: ± 6.2% ± 5%
Software features		Thermal property calculation; Multi level analysis; database

		NanoTR	PicoTR
host	temperature range 真空度 Measurement Mode	RT, RT... 300 ° C (optional) N/A RF/FF	RT, RT... 500 ° C (optional) 10^-6 Mbar (optional) RF/FF
measurement items		Thermal diffusivity coefficient, heat absorption coefficient, interface thermal resistance
Heating laser	pulse width wavelength spot diameter	1 ns 1550 nm 100 μm	0.5 ps 1550 nm 45 μm
Detecting laser	pulse width wavelength spot diameter	continuous 785 nm 50 μm	0.5 ps 775 nm 25 μm
Sample thin layer thickness (RF mode)	resin ceramics metal	30 nm . .. 2 μm 300 nm . .. 5 μm 1 μm . .. 20 μm	10 nm . .. 100 nm 10 nm . .. 300 nm 100 nm . .. 900 nm
Sample thin layer thickness (FF mode)		> 1 μm	> 100 nm
matrix	material size thickness	Opaque/Transparent 10... 20mm square ≤ 1 mm
Thermal diffusion time		10ns . .. 10µs	10ps . .. 10ns
thermal diffusivity	scope accuracy repetitiveness	0.01 . .. 1000 mm²/s CRM 5808A, 400nm thickness, RF mode, 40min test time verification: ± 6.2% ± 5%
Software features		Thermal property calculation; Multi level analysis; database

		NanoTR	PicoTR
host	temperature range 真空度 Measurement Mode	RT, RT... 300 ° C (optional) N/A RF/FF	RT, RT... 500 ° C (optional) 10^-6 Mbar (optional) RF/FF
measurement items		Thermal diffusivity coefficient, heat absorption coefficient, interface thermal resistance
Heating laser	pulse width wavelength spot diameter	1 ns 1550 nm 100 μm	0.5 ps 1550 nm 45 μm
Detecting laser	pulse width wavelength spot diameter	continuous 785 nm 50 μm	0.5 ps 775 nm 25 μm
Sample thin layer thickness (RF mode)	resin ceramics metal	30 nm . .. 2 μm 300 nm . .. 5 μm 1 μm . .. 20 μm	10 nm . .. 100 nm 10 nm . .. 300 nm 100 nm . .. 900 nm
Sample thin layer thickness (FF mode)		> 1 μm	> 100 nm
matrix	material size thickness	Opaque/Transparent 10... 20mm square ≤ 1 mm
Thermal diffusion time		10ns . .. 10µs	10ps . .. 10ns
thermal diffusivity	scope accuracy repetitiveness	0.01 . .. 1000 mm²/s CRM 5808A, 400nm thickness, RF mode, 40min test time verification: ± 6.2% ± 5%
Software features		Thermal property calculation; Multi level analysis; database